Part 5 of the Silicon Scarcity Asset Matrix series from Exotics Wanted
This is the data appendix, the complete exotic car semiconductor risk data for the Silicon Scarcity Asset Matrix series. Four tables consolidate the Silicon Scarcity composite scores for twelve exotic vehicles, chip identifications from Bosch to Qualcomm, factory statuses across fourteen semiconductor facilities, and architecture classifications published across Part 1: The Analog Premium, Part 2: The Silicon Scarcity Asset Matrix, Part 3: Digital Due Diligence, and Part 4: The Window. Each table maps the specific fabrication node in your vehicle against the factory closure schedules and capacity reallocations documented through the 2026-2028 window.
If you have read the series, bookmark this page. If you have not, start with Part 1.
Chip Architecture
Table 1: Model-to-Chip Map
Every vehicle in the Silicon Scarcity coverage universe, the primary semiconductor controlling its powertrain, where that chip is fabricated, and whether the production line is still running. Chip associations marked “Confirmed” are verified through documented teardowns, supplier disclosures, or manufacturer technical publications. Those marked “Inferred” are derived from platform analysis and known supplier relationships. Full scoring analysis for each model appears in Part 2 (composites 38 to 53) and Part 3 (composites 14 to 33).
| Model | Primary ECU/MCU | Process Node | Foundry | Production Status | Confidence | Architecture Category |
|---|---|---|---|---|---|---|
| Ferrari F355 | Bosch Motronic 2.7 / Intel 87C196KN | ~1000nm (discrete, through-hole) | N/A (pre-foundry era) | N/A (component-level rebuildable) | Confirmed | 1: Pre-chip |
| Lamborghini Aventador SVJ | Bosch MED17.1.x / Infineon AURIX TC2xx | 65nm | Infineon Dresden, Germany | Active | Inferred | 3: Ample-Supply |
| Ferrari 812 Competizione | Bosch MED17.3.5 / Infineon TriCore TC17xx | 65nm | Infineon Dresden, Germany | Active | Confirmed | 3: Ample-Supply |
| Porsche 911 GT3 (992) | Bosch MG1CS047 / Infineon AURIX TC2xx-TC3xx | 65nm to 40nm | Infineon Dresden, Germany | Active | Confirmed | 3: Ample-Supply |
| Audi R8 V10 | Bosch / Infineon C166-TC17xx | 130nm to 180nm | Infineon (200mm wafer lines) | NRND | Confirmed | 2: Extinction-Node |
| Ferrari 812 Superfast | Marelli (TC277-based) / Infineon AURIX TC277 | 65nm | Infineon Dresden, Germany | Active | Confirmed | 3: Ample-Supply |
| Bugatti Chiron | Bosch MED17.1.12 (dual) / Infineon TC1793 | 65nm | Infineon Dresden/Villach | Active | Confirmed | 3: Ample-Supply |
| Lamborghini Revuelto | Bosch MG1CS (V12 ECU) / AURIX TC3xx + Qualcomm Snapdragon Digital Chassis (cockpit) | 40nm (powertrain) + 5nm (cockpit) | TSMC Taiwan (powertrain), TSMC/Samsung (cockpit) | Active (both nodes) | Inferred | 4: Dual-Architecture |
| McLaren 720S | Bosch ME17.8.3.x / Infineon TC1797 | 65nm to 90nm | Infineon Dresden/Villach | Active (65nm), NRND (90nm) | Inferred | 3: Ample-Supply |
| Ferrari SF90 Stradale | Marelli/Bosch (dual) / STMicro SPC5xx or Infineon AURIX + SiC inverter modules | 40nm to 65nm (powertrain) + 5nm to 7nm (hybrid controls) | STMicro Agrate/Crolles, Infineon Dresden | Active (legacy nodes) | Inferred | 4: Dual-Architecture |
| McLaren Artura | Bosch MED17.8.33 / Infineon TC1793 + zonal Ethernet controllers | 65nm (engine) + mixed (zonal network) | Infineon Dresden, Germany | Active (engine ECU) | Confirmed (engine), Inferred (zonal) | 4: Dual-Architecture |
| Maserati GranTurismo Folgore | Qualcomm Snapdragon Cockpit (digital) + 3x 205kW PM motors / SiC inverters (powertrain) | 5nm (cockpit SoC) + various (power electronics) | TSMC/Samsung (SoC), multiple (SiC) | Active with AI contention | Inferred | 6: Full Digital/EV |
Factory Status
Table 2: Factory Status Tracker
Every semiconductor fabrication facility referenced in the Silicon Scarcity Asset Matrix series, its operating status, and its relevance to the twelve vehicles scored. Factory status data reflects conditions as of Q1 2026. Fab status changes quarterly; this table is updated with each content cycle. The convergence timeline connecting these factory events to specific vehicle scores is detailed in Part 4: The Window.
| Facility | Owner | Location | Primary Node(s) | Status | Capacity | Automotive Relevance | Timeline |
|---|---|---|---|---|---|---|---|
| Samsung Giheung S7 | Samsung | Giheung, South Korea | 130nm/90nm BCD (200mm) | Decommissioning | ~50,000 wpm (200mm) | PMICs regulating voltage rails in ECU platforms across multiple marques | Closure H2 2026; orders transferring now |
| TSMC Fab 2 | TSMC | Hsinchu, Taiwan | Legacy (200mm) | Decommissioning | Not disclosed | Legacy analog and mixed-signal automotive components | Closure by end 2027 |
| TSMC Fab 5 | TSMC | Hsinchu, Taiwan | Legacy (200mm) | Decommissioning | Not disclosed | Legacy analog and mixed-signal automotive components | Closure by end 2027 |
| TSMC Fab 14 | TSMC | Tainan, Taiwan | Mature-node (300mm) | Transitioning | Capacity cut 15-20% by 2028 | 28nm to 65nm automotive MCUs and analog | Reduction through 2028 |
| ESMC Dresden | TSMC 70%, Bosch 10%, Infineon 10%, NXP 10% | Dresden, Germany | 28nm, 22nm, 16nm, 12nm | Under construction | 40,000 wpm target | EU’s first FinFET foundry; BMW, Mercedes, VW Group, Stellantis named as beneficiaries | Shell complete Jan 2026; equipment install H2 2026; full capacity 2029 |
| GF-STMicro Crolles | GlobalFoundries-STMicro JV | Crolles, France | 18nm FD-SOI | Suspended | Planned 620,000 wafers/year | FD-SOI automotive MCUs and connectivity chips | Expansion suspended Jan 2026 |
| TSMC Kumamoto Fab 1 (JASM) | TSMC 86.5%, Sony 6%, Denso 5.5%, Toyota 2% | Kumamoto, Japan | 40nm, 28nm, 22nm, 16nm/12nm | Active (underutilized) | 55,000 wpm | Infineon AURIX TC4x (28nm), NXP S32G2 (16nm), Denso processors | Production started late Dec 2024; ~50% utilization through mid-2025 |
| TSMC Kumamoto Fab 2 (JASM) | Same consortium | Kumamoto, Japan | 3nm (pivoted from original 6nm) | Planning/construction | TBD | Originally automotive-focused 6nm; now AI-oriented 3nm | CEO C.C. Wei confirmed 3nm pivot Feb 5, 2026 |
| Bosch Reutlingen | Bosch | Reutlingen, Germany | Various (200mm) | Active | Not disclosed | MEMS sensors, SiC MOSFETs; found in virtually every vehicle platform | Stable; no capacity conversion to AI |
| Bosch Dresden | Bosch | Dresden, Germany | Various (300mm) | Active | Not disclosed | Power semiconductors, automotive ASICs; adding 300mm MEMS production 2026 | Stable; SiC expansion via acquired Roseville, CA fab |
| TI Lehi | Texas Instruments | Lehi, Utah | 65nm to 28nm (300mm) | Active | Production since Dec 2022 | Jacinto processors, power management; foundational automotive analog | LFAB2 ($11B) targets 2026 production start |
| TI Sherman | Texas Instruments | Sherman, Texas | 28nm to 130nm (300mm) | Active | SM1 production since 2025 | Analog, power management, SiGe technology; over 150M automotive processors deployed | Part of $60B+ multi-fab buildout |
| Infineon Villach | Infineon | Villach, Austria | Various (300mm) | Active (partially converting) | Not disclosed | Power semiconductors, IGBT modules, CoolSiC; serves EV platforms | CEO confirmed IGBT-to-AI MOSFET conversion Feb 4, 2026 |
| Infineon Dresden | Infineon | Dresden, Germany | 65nm and others (300mm) | Active (partially converting) | Not disclosed | AURIX TriCore MCUs powering engine management in 9 of 12 matrix vehicles | Capital investment favoring AI power; legacy 65nm lines not immediately threatened |
Scoring Matrix
Table 3: Composite Score Matrix
Twelve models scored across six metrics on a 1 to 10 scale, where 10 represents maximum resilience. The composite is the unweighted sum. S:HP measures semiconductor dependency. Node Longevity measures chip production horizon adjusted for allocation competition. Geopolitical Resilience measures fabrication geography. Repair Sovereignty measures who can fix it. Residual Stability measures documented market performance. Supply Priority measures institutional procurement leverage. Full metric definitions and model-by-model scoring defenses appear in Part 2 and Part 3.
| Rank | Model | S:HP | Node | Geo | Repair | Residual | Supply | Composite | Profile Type |
|---|---|---|---|---|---|---|---|---|---|
| #1 | Ferrari F355 | 10 | 10 | 9 | 9 | 7 | 8 | 53 | Analog Sovereign |
| #2 | Aventador SVJ | 8 | 6 | 7 | 7 | 9 | 8 | 45 | Sovereign |
| #3 | 812 Competizione | 7 | 6 | 8 | 5 | 10 | 7 | 43 | Sovereign |
| #4 | 911 GT3 (992) | 7 | 6 | 7 | 6 | 7 | 9 | 42 | Resilient Benchmark |
| #5 | Audi R8 V10 | 9 | 3 | 8 | 7 | 6 | 7 | 40 | Analog at Risk (Extinction Node) |
| #6 | 812 Superfast | 7 | 6 | 8 | 5 | 5 | 7 | 38 | Transitional |
| #7 | Bugatti Chiron | 5 | 6 | 7 | 4 | 6 | 5 | 33 | Protected Dependent |
| #8 | Revuelto | 4 | 5 | 6 | 3 | 4 | 8 | 30 | Complex Dependent |
| #8t | McLaren 720S | 7 | 5 | 6 | 5 | 5 | 2 | 30 | Analog at Risk |
| #10 | SF90 Stradale | 3 | 4 | 7 | 3 | 3 | 7 | 27 | Collapsed |
| #11 | McLaren Artura | 4 | 5 | 5 | 3 | 2 | 2 | 21 | Collapsed |
| #12 | Maserati GranTurismo Folgore | 1 | 5 | 4 | 1 | 1 | 2 | 14 | Collapsed (EV) |
Revuelto and 720S tie at 30; ranked by Supply Priority (8 vs. 2). All scores reflect the v4 methodology locked February 2026. Production runway is not allocation availability: a chip fabricated on a 5nm node will be manufactured for decades, but automotive receives 4 to 5% of TSMC’s advanced-node allocation while AI and high-performance computing take 57 to 58%.
Taxonomy Reference
Table 4: Chip Taxonomy Categories
The six architecture categories that classify every vehicle in the Silicon Scarcity coverage universe by semiconductor profile. The taxonomy was introduced in Part 1: The Analog Premium and applied throughout the scoring in Parts 2 and 3. The timeline implications of each category are documented in Part 4: The Window.
| Cat. | Name | Node Range | Wafer Size | Representative Models | Risk Profile | Series Reference |
|---|---|---|---|---|---|---|
| 1 | Pre-chip | N/A (discrete, through-hole) | N/A | F355 | Zero semiconductor risk. ECU boards individually rebuildable at component level for under $1,000. | Part 2 |
| 2 | Extinction-Node | 130nm+ | 200mm | R8 V10 | Active decommissioning of 200mm wafer lines (Samsung Giheung H2 2026, TSMC Fab 2/5 by end 2027). Module-level replacement required; component-level rebuild not feasible. | Part 2 |
| 3 | Ample-Supply | 40nm to 65nm | 300mm | SVJ, 812 Comp, 812 SF, GT3, 720S, Chiron | Active production at multiple foundries. Zero AI competition at these nodes. 10 to 15 year production runway. ESMC Dresden (2029) adds European FinFET capacity at 28nm to 12nm. | Parts 2, 3 |
| 4 | Dual-Architecture / AI-Contested | Mixed (40nm powertrain + 5nm to 7nm cockpit) | 300mm | SF90, Revuelto, Artura | Powertrain silicon on safe legacy nodes; cockpit and hybrid control chips compete with AI for foundry allocation. Dual-node exposure creates vulnerability on two fronts simultaneously. | Parts 3, 4 |
| 5 | Advanced Digital (2nm/3nm) | 2nm to 3nm | 300mm | No current road cars | Forward-looking. TSMC Kumamoto Fab 2 pivoted from 6nm automotive to 3nm AI (confirmed Feb 5, 2026). Renesas R-Car X5H sampling on 3nm. No scored vehicles in this category. | Part 4 (narrative) |
| 6 | Full Digital / EV | 5nm SoC + SiC power | 300mm | Folgore | Maximum silicon density. Every subsystem semiconductor-dependent. Highest exposure to AI allocation competition and corporate supply chain instability. | Part 3 |
Common Questions
Frequently Asked Questions
How is the Silicon Scarcity composite score calculated?
Six metrics scored 1 to 10 based on each vehicle’s specific semiconductor architecture, supply chain position, and documented market performance. The composite is the unweighted sum, with a maximum possible score of 60. Full metric definitions and the scoring scale for each metric appear in Part 2.
Which exotic cars have the highest semiconductor risk?
The Maserati GranTurismo Folgore (14/60), McLaren Artura (21/60), and Ferrari SF90 Stradale (27/60) carry the highest semiconductor exposure in our coverage universe. Their scores reflect a combination of advanced-node allocation competition, repair restrictions, and documented depreciation.
What chip architecture does the Ferrari F355 use?
The F355 uses Bosch Motronic 2.7 engine management with a discrete, through-hole Intel 87C196KN processor that predates modern semiconductor dependency. Its ECU boards are individually rebuildable at the component level for under $1,000, which is why it scores 53/60: the highest composite in the matrix.
How often is this data updated?
Factory status and production data are reviewed quarterly. Scoring methodology updates require a full re-evaluation cycle and are versioned in our internal documentation. The current scores reflect the v4 methodology locked in February 2026.
What do the factory status categories mean?
Active means the facility is producing automotive-grade silicon at documented capacity. Transitioning means the fab is shifting node focus, converting production lines, or undergoing capacity reduction (the “blackout period” described in Part 4 where tools are neither where they were nor where they will be). Decommissioning means the facility’s automotive-relevant production lines are being permanently shut down or the site is being converted to non-production use. NRND (Not Recommended for New Designs) means the chip remains available from existing inventory or low-volume production but the manufacturer has signaled the end of its active lifecycle.
Disclaimer: The Silicon Scarcity Asset Matrix is a proprietary framework developed by Exotics Wanted. The terms “Silicon Scarcity Asset Matrix,” “Analog Premium,” “Silicon Discount,” and “Legacy Wall” are proprietary to Exotics Wanted. This analysis is provided for informational purposes only and does not constitute investment advice, vehicle appraisal, or guarantee of future market performance. Semiconductor production data reflects publicly available information as of Q1 2026 and is subject to change.
Exotics Wanted is a boutique vehicle acquisition group specializing in exotic and luxury vehicles. Learn more about our approach.