Market Pulse

Driven by proprietary market analytics. This month’s movers.

Ferrari 488 GTB Values up 9.7% YoY
Porsche 911 GT3 (992) Allocation premiums holding
Lamborghini Huracan Best value retention in class
Audi R8 Final V10 — prices rising 5% against market
BMW M3 Competition Strong demand holding
Bentley Continental GT Estate sale volume rising
Ferrari SF90 Stradale $278K depreciation — sellers moving now
McLaren 720S Steepest depreciation in segment

Part 5: Exotic Car Semiconductor Risk Data. The 2026-2028 Index.

Silicon Scarcity reference tables showing semiconductor chip data for twelve exotic cars including Ferrari, Porsche, Lamborghini, McLaren, and Maserati models

Part 5 of the Silicon Scarcity Asset Matrix series from Exotics Wanted

This is the data appendix, the complete exotic car semiconductor risk data for the Silicon Scarcity Asset Matrix series. Four tables consolidate the Silicon Scarcity composite scores for twelve exotic vehicles, chip identifications from Bosch to Qualcomm, factory statuses across fourteen semiconductor facilities, and architecture classifications published across Part 1: The Analog Premium, Part 2: The Silicon Scarcity Asset Matrix, Part 3: Digital Due Diligence, and Part 4: The Window. Each table maps the specific fabrication node in your vehicle against the factory closure schedules and capacity reallocations documented through the 2026-2028 window.

If you have read the series, bookmark this page. If you have not, start with Part 1.

Chip Architecture

Table 1: Model-to-Chip Map

Every vehicle in the Silicon Scarcity coverage universe, the primary semiconductor controlling its powertrain, where that chip is fabricated, and whether the production line is still running. Chip associations marked “Confirmed” are verified through documented teardowns, supplier disclosures, or manufacturer technical publications. Those marked “Inferred” are derived from platform analysis and known supplier relationships. Full scoring analysis for each model appears in Part 2 (composites 38 to 53) and Part 3 (composites 14 to 33).

Model Primary ECU/MCU Process Node Foundry Production Status Confidence Architecture Category
Ferrari F355 Bosch Motronic 2.7 / Intel 87C196KN ~1000nm (discrete, through-hole) N/A (pre-foundry era) N/A (component-level rebuildable) Confirmed 1: Pre-chip
Lamborghini Aventador SVJ Bosch MED17.1.x / Infineon AURIX TC2xx 65nm Infineon Dresden, Germany Active Inferred 3: Ample-Supply
Ferrari 812 Competizione Bosch MED17.3.5 / Infineon TriCore TC17xx 65nm Infineon Dresden, Germany Active Confirmed 3: Ample-Supply
Porsche 911 GT3 (992) Bosch MG1CS047 / Infineon AURIX TC2xx-TC3xx 65nm to 40nm Infineon Dresden, Germany Active Confirmed 3: Ample-Supply
Audi R8 V10 Bosch / Infineon C166-TC17xx 130nm to 180nm Infineon (200mm wafer lines) NRND Confirmed 2: Extinction-Node
Ferrari 812 Superfast Marelli (TC277-based) / Infineon AURIX TC277 65nm Infineon Dresden, Germany Active Confirmed 3: Ample-Supply
Bugatti Chiron Bosch MED17.1.12 (dual) / Infineon TC1793 65nm Infineon Dresden/Villach Active Confirmed 3: Ample-Supply
Lamborghini Revuelto Bosch MG1CS (V12 ECU) / AURIX TC3xx + Qualcomm Snapdragon Digital Chassis (cockpit) 40nm (powertrain) + 5nm (cockpit) TSMC Taiwan (powertrain), TSMC/Samsung (cockpit) Active (both nodes) Inferred 4: Dual-Architecture
McLaren 720S Bosch ME17.8.3.x / Infineon TC1797 65nm to 90nm Infineon Dresden/Villach Active (65nm), NRND (90nm) Inferred 3: Ample-Supply
Ferrari SF90 Stradale Marelli/Bosch (dual) / STMicro SPC5xx or Infineon AURIX + SiC inverter modules 40nm to 65nm (powertrain) + 5nm to 7nm (hybrid controls) STMicro Agrate/Crolles, Infineon Dresden Active (legacy nodes) Inferred 4: Dual-Architecture
McLaren Artura Bosch MED17.8.33 / Infineon TC1793 + zonal Ethernet controllers 65nm (engine) + mixed (zonal network) Infineon Dresden, Germany Active (engine ECU) Confirmed (engine), Inferred (zonal) 4: Dual-Architecture
Maserati GranTurismo Folgore Qualcomm Snapdragon Cockpit (digital) + 3x 205kW PM motors / SiC inverters (powertrain) 5nm (cockpit SoC) + various (power electronics) TSMC/Samsung (SoC), multiple (SiC) Active with AI contention Inferred 6: Full Digital/EV

Factory Status

Table 2: Factory Status Tracker

Every semiconductor fabrication facility referenced in the Silicon Scarcity Asset Matrix series, its operating status, and its relevance to the twelve vehicles scored. Factory status data reflects conditions as of Q1 2026. Fab status changes quarterly; this table is updated with each content cycle. The convergence timeline connecting these factory events to specific vehicle scores is detailed in Part 4: The Window.

Facility Owner Location Primary Node(s) Status Capacity Automotive Relevance Timeline
Samsung Giheung S7 Samsung Giheung, South Korea 130nm/90nm BCD (200mm) Decommissioning ~50,000 wpm (200mm) PMICs regulating voltage rails in ECU platforms across multiple marques Closure H2 2026; orders transferring now
TSMC Fab 2 TSMC Hsinchu, Taiwan Legacy (200mm) Decommissioning Not disclosed Legacy analog and mixed-signal automotive components Closure by end 2027
TSMC Fab 5 TSMC Hsinchu, Taiwan Legacy (200mm) Decommissioning Not disclosed Legacy analog and mixed-signal automotive components Closure by end 2027
TSMC Fab 14 TSMC Tainan, Taiwan Mature-node (300mm) Transitioning Capacity cut 15-20% by 2028 28nm to 65nm automotive MCUs and analog Reduction through 2028
ESMC Dresden TSMC 70%, Bosch 10%, Infineon 10%, NXP 10% Dresden, Germany 28nm, 22nm, 16nm, 12nm Under construction 40,000 wpm target EU’s first FinFET foundry; BMW, Mercedes, VW Group, Stellantis named as beneficiaries Shell complete Jan 2026; equipment install H2 2026; full capacity 2029
GF-STMicro Crolles GlobalFoundries-STMicro JV Crolles, France 18nm FD-SOI Suspended Planned 620,000 wafers/year FD-SOI automotive MCUs and connectivity chips Expansion suspended Jan 2026
TSMC Kumamoto Fab 1 (JASM) TSMC 86.5%, Sony 6%, Denso 5.5%, Toyota 2% Kumamoto, Japan 40nm, 28nm, 22nm, 16nm/12nm Active (underutilized) 55,000 wpm Infineon AURIX TC4x (28nm), NXP S32G2 (16nm), Denso processors Production started late Dec 2024; ~50% utilization through mid-2025
TSMC Kumamoto Fab 2 (JASM) Same consortium Kumamoto, Japan 3nm (pivoted from original 6nm) Planning/construction TBD Originally automotive-focused 6nm; now AI-oriented 3nm CEO C.C. Wei confirmed 3nm pivot Feb 5, 2026
Bosch Reutlingen Bosch Reutlingen, Germany Various (200mm) Active Not disclosed MEMS sensors, SiC MOSFETs; found in virtually every vehicle platform Stable; no capacity conversion to AI
Bosch Dresden Bosch Dresden, Germany Various (300mm) Active Not disclosed Power semiconductors, automotive ASICs; adding 300mm MEMS production 2026 Stable; SiC expansion via acquired Roseville, CA fab
TI Lehi Texas Instruments Lehi, Utah 65nm to 28nm (300mm) Active Production since Dec 2022 Jacinto processors, power management; foundational automotive analog LFAB2 ($11B) targets 2026 production start
TI Sherman Texas Instruments Sherman, Texas 28nm to 130nm (300mm) Active SM1 production since 2025 Analog, power management, SiGe technology; over 150M automotive processors deployed Part of $60B+ multi-fab buildout
Infineon Villach Infineon Villach, Austria Various (300mm) Active (partially converting) Not disclosed Power semiconductors, IGBT modules, CoolSiC; serves EV platforms CEO confirmed IGBT-to-AI MOSFET conversion Feb 4, 2026
Infineon Dresden Infineon Dresden, Germany 65nm and others (300mm) Active (partially converting) Not disclosed AURIX TriCore MCUs powering engine management in 9 of 12 matrix vehicles Capital investment favoring AI power; legacy 65nm lines not immediately threatened

Scoring Matrix

Table 3: Composite Score Matrix

Twelve models scored across six metrics on a 1 to 10 scale, where 10 represents maximum resilience. The composite is the unweighted sum. S:HP measures semiconductor dependency. Node Longevity measures chip production horizon adjusted for allocation competition. Geopolitical Resilience measures fabrication geography. Repair Sovereignty measures who can fix it. Residual Stability measures documented market performance. Supply Priority measures institutional procurement leverage. Full metric definitions and model-by-model scoring defenses appear in Part 2 and Part 3.

Rank Model S:HP Node Geo Repair Residual Supply Composite Profile Type
#1 Ferrari F355 10 10 9 9 7 8 53 Analog Sovereign
#2 Aventador SVJ 8 6 7 7 9 8 45 Sovereign
#3 812 Competizione 7 6 8 5 10 7 43 Sovereign
#4 911 GT3 (992) 7 6 7 6 7 9 42 Resilient Benchmark
#5 Audi R8 V10 9 3 8 7 6 7 40 Analog at Risk (Extinction Node)
#6 812 Superfast 7 6 8 5 5 7 38 Transitional
#7 Bugatti Chiron 5 6 7 4 6 5 33 Protected Dependent
#8 Revuelto 4 5 6 3 4 8 30 Complex Dependent
#8t McLaren 720S 7 5 6 5 5 2 30 Analog at Risk
#10 SF90 Stradale 3 4 7 3 3 7 27 Collapsed
#11 McLaren Artura 4 5 5 3 2 2 21 Collapsed
#12 Maserati GranTurismo Folgore 1 5 4 1 1 2 14 Collapsed (EV)

Revuelto and 720S tie at 30; ranked by Supply Priority (8 vs. 2). All scores reflect the v4 methodology locked February 2026. Production runway is not allocation availability: a chip fabricated on a 5nm node will be manufactured for decades, but automotive receives 4 to 5% of TSMC’s advanced-node allocation while AI and high-performance computing take 57 to 58%.

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Taxonomy Reference

Table 4: Chip Taxonomy Categories

The six architecture categories that classify every vehicle in the Silicon Scarcity coverage universe by semiconductor profile. The taxonomy was introduced in Part 1: The Analog Premium and applied throughout the scoring in Parts 2 and 3. The timeline implications of each category are documented in Part 4: The Window.

Cat. Name Node Range Wafer Size Representative Models Risk Profile Series Reference
1 Pre-chip N/A (discrete, through-hole) N/A F355 Zero semiconductor risk. ECU boards individually rebuildable at component level for under $1,000. Part 2
2 Extinction-Node 130nm+ 200mm R8 V10 Active decommissioning of 200mm wafer lines (Samsung Giheung H2 2026, TSMC Fab 2/5 by end 2027). Module-level replacement required; component-level rebuild not feasible. Part 2
3 Ample-Supply 40nm to 65nm 300mm SVJ, 812 Comp, 812 SF, GT3, 720S, Chiron Active production at multiple foundries. Zero AI competition at these nodes. 10 to 15 year production runway. ESMC Dresden (2029) adds European FinFET capacity at 28nm to 12nm. Parts 2, 3
4 Dual-Architecture / AI-Contested Mixed (40nm powertrain + 5nm to 7nm cockpit) 300mm SF90, Revuelto, Artura Powertrain silicon on safe legacy nodes; cockpit and hybrid control chips compete with AI for foundry allocation. Dual-node exposure creates vulnerability on two fronts simultaneously. Parts 3, 4
5 Advanced Digital (2nm/3nm) 2nm to 3nm 300mm No current road cars Forward-looking. TSMC Kumamoto Fab 2 pivoted from 6nm automotive to 3nm AI (confirmed Feb 5, 2026). Renesas R-Car X5H sampling on 3nm. No scored vehicles in this category. Part 4 (narrative)
6 Full Digital / EV 5nm SoC + SiC power 300mm Folgore Maximum silicon density. Every subsystem semiconductor-dependent. Highest exposure to AI allocation competition and corporate supply chain instability. Part 3

Common Questions

Frequently Asked Questions

How is the Silicon Scarcity composite score calculated?

Six metrics scored 1 to 10 based on each vehicle’s specific semiconductor architecture, supply chain position, and documented market performance. The composite is the unweighted sum, with a maximum possible score of 60. Full metric definitions and the scoring scale for each metric appear in Part 2.

Which exotic cars have the highest semiconductor risk?

The Maserati GranTurismo Folgore (14/60), McLaren Artura (21/60), and Ferrari SF90 Stradale (27/60) carry the highest semiconductor exposure in our coverage universe. Their scores reflect a combination of advanced-node allocation competition, repair restrictions, and documented depreciation.

What chip architecture does the Ferrari F355 use?

The F355 uses Bosch Motronic 2.7 engine management with a discrete, through-hole Intel 87C196KN processor that predates modern semiconductor dependency. Its ECU boards are individually rebuildable at the component level for under $1,000, which is why it scores 53/60: the highest composite in the matrix.

How often is this data updated?

Factory status and production data are reviewed quarterly. Scoring methodology updates require a full re-evaluation cycle and are versioned in our internal documentation. The current scores reflect the v4 methodology locked in February 2026.

What do the factory status categories mean?

Active means the facility is producing automotive-grade silicon at documented capacity. Transitioning means the fab is shifting node focus, converting production lines, or undergoing capacity reduction (the “blackout period” described in Part 4 where tools are neither where they were nor where they will be). Decommissioning means the facility’s automotive-relevant production lines are being permanently shut down or the site is being converted to non-production use. NRND (Not Recommended for New Designs) means the chip remains available from existing inventory or low-volume production but the manufacturer has signaled the end of its active lifecycle.

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Disclaimer: The Silicon Scarcity Asset Matrix is a proprietary framework developed by Exotics Wanted. The terms “Silicon Scarcity Asset Matrix,” “Analog Premium,” “Silicon Discount,” and “Legacy Wall” are proprietary to Exotics Wanted. This analysis is provided for informational purposes only and does not constitute investment advice, vehicle appraisal, or guarantee of future market performance. Semiconductor production data reflects publicly available information as of Q1 2026 and is subject to change.

Exotics Wanted is a boutique vehicle acquisition group specializing in exotic and luxury vehicles. Learn more about our approach.

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